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8.4.3. Packaging
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11 questions on this section. Wrong answers show you what to read again.
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Revision test
Mixed questions from across the chapter. Your answers get marked.
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Flashcard drill
4 cards from this lesson. Good the night before a test.
Try these first
- 1.
What is packaging in MEMS fabrication?
Hint
Think about why devices need protection.
- 2.
Name one method of packaging.
Hint
Recall any technique we discussed.
- 3.
What does packaging in MEMS primarily ensure?
- Better performance
- Protection from environment
- Ease of fabrication
Hint
Consider the risks that devices face without coverage.
- 4.
True or False: Flip-chip bonding is a method where the MEMS chip is placed face up.
- True
- False
Hint
Think about the name itself, does it indicate a position?
- 5.
Discuss how inadequate packaging can lead to the failure of MEMS devices in harsh environments.
Hint
Think about real-world examples where environments can harm electronics.
- 6.
Evaluate the cost-benefit aspects of using flip-chip bonding versus traditional methods like wire bonding.
Hint
What advantages might a device size reduction provide?
Exercises
Total Questions
2
Estimated Time
4 min
Passing Score
70%
Instructions
- Read each question carefully
- You can use hints if you need help
- Complete all questions before submitting
4 more questions available
Enrol freeQuiz
Total Questions
2
Estimated Time
4 min
Passing Score
70%
Instructions
- Read each question carefully
- You can use hints if you need help
- Complete all questions before submitting
1 more question available
Enrol freeChallenge Problems
Total Questions
2
Estimated Time
4 min
Passing Score
70%
Instructions
- Read each question carefully
- You can use hints if you need help
- Complete all questions before submitting