Practice Case Studies – Examining Challenges and Solutions in Process Integration - 8 | 8. Case Studies – Examining Challenges and Solutions in Process Integration | Advanced Semiconductor Manufacturing
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What does RCA stand for?

💡 Hint: Think about the process of identifying problems.

Question 2

Easy

What is one method used in Statistical Process Control?

💡 Hint: Consider how data is analyzed over time.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What issue did Case Study 1 focus on?

  • Copper vias delamination
  • Spacer width variation
  • Poly-Si etch selectivity

💡 Hint: Recall the specific challenge faced in FinFET development.

Question 2

True or False: Line collapse in BEOL was caused by high aspect ratio vias combined with wet clean processes.

  • True
  • False

💡 Hint: Think about how physical processes impact integrity.

Solve and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Given a new semiconductor product, outline the steps of a root cause analysis if a significant yield drop occurs during production.

💡 Hint: Consider what data you would need and how you would analyze it.

Question 2

Propose a comprehensive improvement plan for a semiconductor company facing increasing line collapse defects in their BEOL process.

💡 Hint: Think about practical changes that can be implemented based on the past case studies.

Challenge and get performance evaluation