Practice - Outcome - 8.2.5
Practice Questions
Test your understanding with targeted questions
What does SPC stand for in the context of semiconductor manufacturing?
💡 Hint: Think about how we monitor processes.
Name one improvement made for the gate poly etch selectivity.
💡 Hint: It involves maintaining consistent conditions.
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Interactive Quizzes
Quick quizzes to reinforce your learning
What improvement was achieved by tightening SPC limits on the ALD tool?
💡 Hint: Remember specific figures mentioned in the case studies.
True or False: Replacing the PVD barrier layer was unnecessary for improving reliability.
💡 Hint: Think about the changes made to enhance process performance.
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Challenge Problems
Push your limits with advanced challenges
Given a hypothetical semiconductor process with a spacer thickness variation of ±2 nm, analyze how this could lead to yield issues and propose one method to rectify it.
💡 Hint: Consider the factors that lead to electrical failures on the die.
In a new fabrication line, the target defect rate is below 1%. Based on the lessons learned from the patterns of past integration issues explored, strategize upon what procedures you would introduce.
💡 Hint: Reflect on what features were key in previous successful outcomes.
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Reference links
Supplementary resources to enhance your learning experience.