Practice Solution (8.3.4) - Case Studies – Examining Challenges and Solutions in Process Integration
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Solution

Practice - Solution - 8.3.4

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Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What does SPC stand for?

💡 Hint: It's a monitoring technique in manufacturing.

Question 2 Easy

What is ALD used for?

💡 Hint: It's a deposition method.

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

What does the term 'Yield Improvement' refer to?

Increase in defective products
Higher number of usable chips from a wafer
Decrease in manufacturing time

💡 Hint: Think about what achieving a good production outcome means.

Question 2

True or False: ALD is solely used for metallization in semiconductor manufacturing.

True
False

💡 Hint: Recall the applications of ALD beyond one type of material.

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Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

Design a mitigation strategy for a suspected yield drop in semiconductor fabrication due to process drift. Include at least three measures.

💡 Hint: Think about both preventative measures and corrective actions.

Challenge 2 Hard

Evaluate the impact of high-aspect-ratio vias on reliability; should they be reduced? Justify your reasoning.

💡 Hint: Consider the physics of materials under stress.

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Reference links

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