Practice Solution - 8.3.4 | 8. Case Studies – Examining Challenges and Solutions in Process Integration | Advanced Semiconductor Manufacturing
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What does SPC stand for?

💡 Hint: It's a monitoring technique in manufacturing.

Question 2

Easy

What is ALD used for?

💡 Hint: It's a deposition method.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What does the term 'Yield Improvement' refer to?

  • Increase in defective products
  • Higher number of usable chips from a wafer
  • Decrease in manufacturing time

💡 Hint: Think about what achieving a good production outcome means.

Question 2

True or False: ALD is solely used for metallization in semiconductor manufacturing.

  • True
  • False

💡 Hint: Recall the applications of ALD beyond one type of material.

Solve and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Design a mitigation strategy for a suspected yield drop in semiconductor fabrication due to process drift. Include at least three measures.

💡 Hint: Think about both preventative measures and corrective actions.

Question 2

Evaluate the impact of high-aspect-ratio vias on reliability; should they be reduced? Justify your reasoning.

💡 Hint: Consider the physics of materials under stress.

Challenge and get performance evaluation