Practice Dry Etching (plasma-based) (8.4.1) - Lithography and Etching Processes Specific to Compound Semiconductors
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Dry Etching (Plasma-Based)

Practice - Dry Etching (Plasma-Based)

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Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What is the primary advantage of dry etching in semiconductor fabrication?

💡 Hint: Think about the level of detail required in semiconductor patterns.

Question 2 Easy

Name one gas commonly used in RIE.

💡 Hint: It’s a reactive gas that begins with 'C.'

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

What is the key benefit of using dry etching?

A. Less precision
B. Higher temperatures
C. High precision

💡 Hint: Consider what is essential for semiconductor devices.

Question 2

True or False: ICP etching provides lower ion density than RIE.

True
False

💡 Hint: Remember which process provides more energetic ions.

1 more question available

Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

Consider a scenario where you must achieve a deeper etch on a GaN layer while maintaining selectivity. Design a new etching approach, discussing your rationale for gas selection, power settings, and process conditions.

💡 Hint: Focus on how different gases affect etch characteristics.

Challenge 2 Hard

You are tasked with reducing etch damage in a sensitive InP sample. Propose specific steps you would take in the etching process to mitigate these risks.

💡 Hint: Think about the balance between effective etching and protecting the material.

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