8. Lithography and Etching Processes Specific to Compound Semiconductors
Lithography and etching are critical processes in semiconductor device fabrication, especially for compound semiconductors, which face unique challenges. The chapter details essential lithography techniques and etching methods to ensure precise pattern transfers while addressing material sensitivities. Dry and wet etching methods are explored, highlighting their importance in achieving device performance amidst complex multi-layer structures.
Sections
Navigate through the learning materials and practice exercises.
What we have learnt
- Lithography and etching are vital for semiconductor device fabrication.
- Compound semiconductors require careful control to prevent damage during processing.
- Multiple etching methods, including dry and wet techniques, are utilized based on specific material characteristics.
Key Concepts
- -- Lithography
- A process used in semiconductor fabrication to transfer patterns from a mask to a substrate.
- -- Etching
- The process of removing material from a substrate to create desired structures on semiconductor devices.
- -- Reactive Ion Etching (RIE)
- A dry etching technique that uses plasma and reactive gases to etch materials with high precision.
- -- Inductively Coupled Plasma (ICP) Etching
- A dry etching method that offers higher ion density and better anisotropy for deep etching of materials.
- -- Wet Chemical Etching
- A method that employs liquid chemical solutions to remove material selectively, useful for certain compound semiconductors.
Additional Learning Materials
Supplementary resources to enhance your learning experience.