Practice Process Flow Example: GaN HEMT Mesa Etching - 8.6 | 8. Lithography and Etching Processes Specific to Compound Semiconductors | Compound Semiconductors
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is photoresist used for in the mesa etching process?

πŸ’‘ Hint: Think about its role in defining areas for etching.

Question 2

Easy

Name one method used for etching the hard mask.

πŸ’‘ Hint: What kind of etching is common for mask materials?

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What is the primary purpose of applying photoresist during the mesa etching process?

  • A. To remove material
  • B. To define areas for etching
  • C. To enhance conductivity

πŸ’‘ Hint: Think about the role of photoresist in the etching.

Question 2

True or False: The hard mask is not required for GaN mesa etching.

  • True
  • False

πŸ’‘ Hint: Consider the functions of a hard mask.

Solve and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Imagine you are leading a team to etch GaN mesas for a new HEMT project. What strategy would you employ to ensure high yield and quality in the final product?

πŸ’‘ Hint: Consider which steps ensure quality and what checks can be put in place.

Question 2

If a batch of wafers shows inconsistent mesa heights post-etch, what processes would you investigate and how would you rectify the issue?

πŸ’‘ Hint: Look at both the preparation and execution phases for potential discrepancies.

Challenge and get performance evaluation