Practice Process Flow Example: Gan Hemt Mesa Etching (8.6) - Lithography and Etching Processes Specific to Compound Semiconductors
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Process Flow Example: GaN HEMT Mesa Etching

Practice - Process Flow Example: GaN HEMT Mesa Etching

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Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What is photoresist used for in the mesa etching process?

💡 Hint: Think about its role in defining areas for etching.

Question 2 Easy

Name one method used for etching the hard mask.

💡 Hint: What kind of etching is common for mask materials?

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

What is the primary purpose of applying photoresist during the mesa etching process?

A. To remove material
B. To define areas for etching
C. To enhance conductivity

💡 Hint: Think about the role of photoresist in the etching.

Question 2

True or False: The hard mask is not required for GaN mesa etching.

True
False

💡 Hint: Consider the functions of a hard mask.

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Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

Imagine you are leading a team to etch GaN mesas for a new HEMT project. What strategy would you employ to ensure high yield and quality in the final product?

💡 Hint: Consider which steps ensure quality and what checks can be put in place.

Challenge 2 Hard

If a batch of wafers shows inconsistent mesa heights post-etch, what processes would you investigate and how would you rectify the issue?

💡 Hint: Look at both the preparation and execution phases for potential discrepancies.

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Reference links

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