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The chapter introduces advanced processes and specialized equipment necessary for modern semiconductor fabrication, emphasizing the need for precision as device dimensions shrink to the nanometer scale. It covers various fabrication techniques, the role of automation and AI in optimizing manufacturing processes, and the importance of maintaining ultra-clean environments. Furthermore, it highlights specific equipment and process steps involved in advanced semiconductor manufacturing.
References
eepe-asm2.pdfClass Notes
Memorization
What we have learnt
Final Test
Revision Tests
Term: Photolithography
Definition: A process used to transfer patterns onto a substrate using light, essential for creating integrated circuits.
Term: Atomic Layer Deposition (ALD)
Definition: A thin film deposition technique that deposits material one atomic layer at a time, ensuring uniform and conformal coatings.
Term: Cleanroom
Definition: A controlled environment with low levels of pollutants, where semiconductor manufacturing processes are carried out.
Term: Automation
Definition: The use of technology to perform tasks without human intervention, which helps in reducing error rates and improving process consistency.
Term: EUV Lithography
Definition: A cutting-edge lithography technique that uses extreme ultraviolet light for printing intricate patterns at very small scales.