Heat Transfer & Thermal Machines | Conduction Heat Transfer by Pavan | Learn Smarter
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Conduction Heat Transfer

The chapter covers various aspects of conduction heat transfer, including steady and unsteady conduction, thermal resistances, and critical insulation thickness. It discusses the methodologies for analyzing one-dimensional and two-dimensional conduction, the lumped system approximation, and enhancements to heat transfer using pin fins. Important equations and principles such as the heat diffusion equation and Biot number are introduced, providing a foundation for understanding heat transfer processes in different geometries.

Sections

  • 1

    Steady 1d Conduction

    This section covers steady-state one-dimensional conduction in different coordinate systems, introducing concepts like heat transfer rate, thermal resistances, and critical thickness of insulation.

  • 1.1

    Cartesian Coordinates (Plane Wall)

    This section covers the principles of heat conduction in a one-dimensional plane wall using Cartesian coordinates, focusing on key equations and solutions.

  • 1.2

    Cylindrical Coordinates (E.g., Pipe Walls)

    This section discusses heat conduction in cylindrical coordinates, particularly focusing on hollow cylinders and their thermal properties.

  • 1.3

    Spherical Coordinates

    This section introduces the principles of heat conduction in spherical coordinates, highlighting key equations and concepts.

  • 2

    Thermal Resistances

    This section discusses various types of thermal resistances in conduction heat transfer, including conduction and convection resistance.

  • 2.1

    Conduction Resistance

    This section explores conduction resistance in heat transfer and its applications in various geometries.

  • 2.2

    Film (Convection) Resistance

    This section explains film (convection) resistance in heat transfer, specifically focusing on its calculation and significance in thermal circuits.

  • 3

    Critical Thickness Of Insulation

    The critical thickness of insulation is a key concept in heat transfer, indicating a specific insulation thickness where added insulation can paradoxically increase heat loss.

  • 4

    Lumped System Approximation

    The Lumped System Approximation is a method used in heat transfer analysis when internal resistance is negligible compared to surface resistance.

  • 5

    Heat Transfer Through Pin Fins

    This section discusses heat transfer through pin fins, focusing on the governing equations and efficiency measurements.

  • 6

    Two-Dimensional Conduction

    This section addresses the principles of two-dimensional heat conduction, governed by Laplace's equation.

  • 7

    Unsteady (Transient) Conduction

    This section focuses on the principles of unsteady or transient heat conduction, described by the heat diffusion equation and common solutions.

Class Notes

Memorization

What we have learnt

  • Heat conduction can occur i...
  • Thermal resistance is analo...
  • Insulation can initially in...

Final Test

Revision Tests