Industry-relevant training in Business, Technology, and Design to help professionals and graduates upskill for real-world careers.
Fun, engaging games to boost memory, math fluency, typing speed, and English skills—perfect for learners of all ages.
The chapter covers various aspects of conduction heat transfer, including steady and unsteady conduction, thermal resistances, and critical insulation thickness. It discusses the methodologies for analyzing one-dimensional and two-dimensional conduction, the lumped system approximation, and enhancements to heat transfer using pin fins. Important equations and principles such as the heat diffusion equation and Biot number are introduced, providing a foundation for understanding heat transfer processes in different geometries.
References
Module II_ Conduction Heat Transfer.pdfClass Notes
Memorization
What we have learnt
Final Test
Revision Tests
Term: Steady Conduction
Definition: Heat conduction where the temperature does not change with time.
Term: Thermal Resistance
Definition: A measure of a material's ability to resist heat flow, crucial for thermal circuit analysis.
Term: Biot Number
Definition: A dimensionless quantity used to determine whether the lumped capacity method is applicable.
Term: Critical Thickness of Insulation
Definition: The thickness at which adding insulation no longer reduces heat loss, important in designing insulated systems.
Term: Pin Fin Heat Transfer
Definition: Using extended surfaces to enhance the effective heat transfer area for improved heat dissipation.
Term: Laplace’s Equation
Definition: A second-order partial differential equation used in two-dimensional steady-state conduction.