Practice Early IC Packaging - 1.3.1 | 1. Introduction to IC Packaging Technologies | IC Packaging
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is a through-hole package?

πŸ’‘ Hint: Think about how the pins connect.

Question 2

Easy

What does DIP stand for in IC packaging?

πŸ’‘ Hint: Remember the two rows of pins.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What is the primary purpose of IC packaging?

  • Cooling
  • Protecting the IC
  • Increasing size

πŸ’‘ Hint: Think about what components need to be shielded.

Question 2

True or False: Dual In-Line Packages are used exclusively for high-reliability applications.

  • True
  • False

πŸ’‘ Hint: Consider the variety of components that use DIPs.

Solve 1 more question and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Draw a diagram illustrating a Dual In-Line Package and label its key components.

πŸ’‘ Hint: Focus on how the pins connect to the PCB.

Question 2

Describe the evolution from through-hole packages to modern packaging methods and discuss the implications for device design.

πŸ’‘ Hint: Think about the push for compact and efficient technology.

Challenge and get performance evaluation