Practice Interconnection Materials - 3.2.3 | 3. Packaging Materials and Interconnection Techniques | IC Packaging
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What are the three main interconnection materials discussed?

πŸ’‘ Hint: Think of valuable metals and their applications.

Question 2

Easy

Which interconnection material is known for its corrosion resistance?

πŸ’‘ Hint: Consider the properties of precious metals.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What is the main advantage of using gold as an interconnection material?

  • Low cost
  • High resistivity
  • Corrosion resistance

πŸ’‘ Hint: Think about how materials respond to environmental factors.

Question 2

True or False: Aluminum has lower conductivity than copper.

  • True
  • False

πŸ’‘ Hint: Recall the properties of each metal.

Solve 1 more question and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

A semiconductor device is required to operate under high temperatures and high reliability. Which interconnection material would you recommend and justify your choice?

πŸ’‘ Hint: Consider thermal conductivity and reliability factors.

Question 2

Design a brief case where the use of aluminum would be justified despite its disadvantages in reliability compared to gold.

πŸ’‘ Hint: Think about the target market and application.

Challenge and get performance evaluation