IC Packaging | 3. Packaging Materials and Interconnection Techniques by Pavan | Learn Smarter
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3. Packaging Materials and Interconnection Techniques

The chapter delves into the materials and techniques used in semiconductor packaging, emphasizing their influence on device performance and reliability. It categorizes packaging materials into substrates, encapsulation, and interconnection materials while detailing interconnection methods such as wire bonding, flip-chip, and solder bump technologies. The evolving demands for miniaturization and high performance drive advancements in these areas.

Sections

  • 3

    Packaging Materials And Interconnection Techniques

    This section discusses the importance of packaging materials and interconnection techniques in semiconductor devices, focusing on their impact on performance and reliability.

    Learning Practice

  • 3.1

    Introduction To Packaging Materials And Interconnection Techniques

    This section introduces the importance of packaging materials and interconnection techniques in semiconductor devices, emphasizing their impact on performance and reliability.

    Learning Practice

  • 3.2

    Packaging Materials

    This section covers the different types of materials used in semiconductor packaging, focusing on substrates, encapsulation, and interconnection materials.

    Learning Practice

  • 3.2.1

    Substrates

    This section covers the different types of substrates used in semiconductor packaging and their critical roles.

    Learning Practice

  • 3.2.2

    Encapsulation Materials

    Encapsulation materials provide essential protection and support for integrated circuits within semiconductor packaging.

    Learning Practice

  • 3.2.3

    Interconnection Materials

    Interconnection materials are critical for effective electrical connections between semiconductor ICs and their packaging or substrates.

    Learning Practice

  • 3.3

    Interconnection Techniques

    This section discusses interconnection techniques in semiconductor packaging, focusing on wire bonding, flip-chip technology, and solder bump technology.

    Learning Practice

  • 3.3.1

    Wire Bonding

    Wire bonding is a common interconnection technique that uses fine wires to establish electrical connections between integrated circuits and printed circuit boards.

    Learning Practice

  • 3.3.2

    Flip-Chip Technology

    Flip-chip technology involves flipping the IC die upside down to establish connections through solder bumps, enhancing performance in high-density applications.

    Learning Practice

  • 3.3.3

    Solder Bump Technology

    Solder bump technology uses small solder bumps for electrical connections in semiconductor packaging, enhancing performance and integration.

    Learning Practice

  • 3.4

    Conclusion

    The choice of packaging materials and interconnection techniques is essential for the performance and reliability of semiconductor devices.

    Learning Practice

References

ee6-icp-3.pdf

Class Notes

Memorization

What we have learnt

  • Effective selection of pack...
  • Wire bonding is the most co...
  • The choice of interconnecti...

Final Test

Revision Tests