3. Packaging Materials and Interconnection Techniques
The chapter delves into the materials and techniques used in semiconductor packaging, emphasizing their influence on device performance and reliability. It categorizes packaging materials into substrates, encapsulation, and interconnection materials while detailing interconnection methods such as wire bonding, flip-chip, and solder bump technologies. The evolving demands for miniaturization and high performance drive advancements in these areas.
Sections
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What we have learnt
- Effective selection of packaging materials is crucial for thermal management and electrical performance.
- Wire bonding is the most common interconnection technique for its cost efficiency, whereas flip-chip and solder bump technologies offer high-density and performance advantages.
- The choice of interconnection method impacts overall device reliability and manufacturing complexity.
Key Concepts
- -- Packaging Materials
- Materials that comprise the protective casing and support structure for semiconductor devices, influencing their reliability and performance.
- -- Wire Bonding
- An interconnection method that uses fine wires to connect semiconductor device leads to the external circuit, offering cost-effective mass production.
- -- FlipChip Technology
- An advanced method where the IC die is flipped and connected via solder bumps, allowing for higher density connections.
- -- Solder Bump Technology
- A flip-chip method that uses solder bumps to create electrical connections between the die and substrate, allowing for improved performance in compact forms.
Additional Learning Materials
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