2. Introduction to Packaging Types
Integrated circuit (IC) packaging is crucial for connecting ICs to external components while providing mechanical support. This chapter examines three primary packaging types: Through-Hole (TH), Surface-Mount (SMT), and Ball Grid Array (BGA), detailing their structures, advantages, disadvantages, and applications. The choice of packaging affects circuit design decision-making based on performance, size, and cost considerations.
Sections
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What we have learnt
- IC packaging plays a vital role in the manufacturing process, ensuring mechanical and electrical connections.
- Different packaging types, including Through-Hole, Surface-Mount, and Ball Grid Array, each have unique advantages and applications.
- Understanding the specific requirements of electronic designs is crucial for selecting the appropriate packaging type.
Key Concepts
- -- ThroughHole Technology (THT)
- An early method of mounting electronic components with leads inserted into plated or unplated holes on a PCB.
- -- SurfaceMount Technology (SMT)
- A modern assembly method where components are mounted directly on the surface of the PCB without requiring holes, allowing for high-density arrangements.
- -- Ball Grid Array (BGA)
- A type of surface-mount packaging using an array of solder balls for connection, offering high pin counts and superior thermal performance.
Additional Learning Materials
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