Practice Conclusion - 2.6 | 2. Introduction to Packaging Types | IC Packaging
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is the main advantage of Through-Hole Packaging?

πŸ’‘ Hint: Think about applications needing strength.

Question 2

Easy

Name one disadvantage of Surface-Mount Technology.

πŸ’‘ Hint: Consider how it stands up to physical stress.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What is a benefit of using BGA?

  • Lower pin count
  • Higher pin count
  • No thermal benefits

πŸ’‘ Hint: Think about its design.

Question 2

True or False: Surface-Mount Technology requires drilled holes.

  • True
  • False

πŸ’‘ Hint: Consider the method of mounting.

Solve and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Design a PCB layout that integrates BGA while considering thermal management for a high-end graphics card.

πŸ’‘ Hint: Research the thermal properties needed for high-performance devices.

Question 2

Evaluate the impact of using SMT in a rugged outdoor sensor application.

πŸ’‘ Hint: Think about the environment the device will be used in.

Challenge and get performance evaluation