Practice Conclusion (2.6) - Introduction to Packaging Types - IC Packaging
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Conclusion

Practice - Conclusion

Learning

Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What is the main advantage of Through-Hole Packaging?

💡 Hint: Think about applications needing strength.

Question 2 Easy

Name one disadvantage of Surface-Mount Technology.

💡 Hint: Consider how it stands up to physical stress.

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

What is a benefit of using BGA?

Lower pin count
Higher pin count
No thermal benefits

💡 Hint: Think about its design.

Question 2

True or False: Surface-Mount Technology requires drilled holes.

True
False

💡 Hint: Consider the method of mounting.

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Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

Design a PCB layout that integrates BGA while considering thermal management for a high-end graphics card.

💡 Hint: Research the thermal properties needed for high-performance devices.

Challenge 2 Hard

Evaluate the impact of using SMT in a rugged outdoor sensor application.

💡 Hint: Think about the environment the device will be used in.

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Reference links

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