Practice Introduction to Packaging Types - 2.1 | 2. Introduction to Packaging Types | IC Packaging
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is Through-Hole technology?

πŸ’‘ Hint: Think about how components are physically mounted.

Question 2

Easy

List one advantage of Surface-Mount Technology.

πŸ’‘ Hint: Consider space-saving and automation.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

Which of the following is an advantage of Through-Hole packaging?

  • Larger size
  • Higher power handling
  • Difficult to repair

πŸ’‘ Hint: Think about durability and power requirements.

Question 2

Ball Grid Array packages are difficult to inspect because:

  • True
  • False

πŸ’‘ Hint: Consider the visibility of the solder joints.

Solve and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Given a scenario where mechanical stress is a prime concern, which packaging type would you recommend and why?

πŸ’‘ Hint: Consider which type balances durability with space.

Question 2

Analyze the cost implications of choosing SMT over Through-Hole for mass manufacturing. What factors come into play?

πŸ’‘ Hint: Evaluate time, space, and labor in manufacturing processes.

Challenge and get performance evaluation