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Test your understanding with targeted questions related to the topic.
Question 1
Easy
What is Through-Hole technology?
π‘ Hint: Think about how components are physically mounted.
Question 2
Easy
List one advantage of Surface-Mount Technology.
π‘ Hint: Consider space-saving and automation.
Practice 4 more questions and get performance evaluation
Engage in quick quizzes to reinforce what you've learned and check your comprehension.
Question 1
Which of the following is an advantage of Through-Hole packaging?
π‘ Hint: Think about durability and power requirements.
Question 2
Ball Grid Array packages are difficult to inspect because:
π‘ Hint: Consider the visibility of the solder joints.
Solve and get performance evaluation
Push your limits with challenges.
Question 1
Given a scenario where mechanical stress is a prime concern, which packaging type would you recommend and why?
π‘ Hint: Consider which type balances durability with space.
Question 2
Analyze the cost implications of choosing SMT over Through-Hole for mass manufacturing. What factors come into play?
π‘ Hint: Evaluate time, space, and labor in manufacturing processes.
Challenge and get performance evaluation