9. Advanced Topics in IC Packaging
The chapter discusses advanced topics in IC packaging, focusing on emerging trends and advanced materials used to meet the demands of modern semiconductor devices. Key topics include 3D packaging, fan-out wafer-level packaging (FOWLP), and innovative materials such as thermal interface materials and advanced substrates. The challenges associated with power density, reliability, and cost are also addressed, highlighting the evolving landscape of IC packaging technologies.
Sections
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What we have learnt
- Advanced IC packaging technologies are essential for meeting the growing demands of the semiconductor industry.
- Emerging techniques like 3D packaging and FOWLP offer significant benefits in terms of performance and size reduction.
- Innovative materials such as advanced thermal interface materials and flexible substrates are vital for enhancing IC performance and reliability.
Key Concepts
- -- 3D IC Packaging
- A technology that involves stacking multiple integrated circuits (ICs) to create a three-dimensional package, allowing for higher integration and smaller footprints.
- -- FanOut WaferLevel Packaging (FOWLP)
- An advanced packaging method where electrical connections of an IC are spread out to a larger area from a reconstituted wafer, allowing for a thinner package with high interconnect density.
- -- Thermal Interface Materials (TIMs)
- Materials that improve thermal conductivity between ICs and heat sinks to effectively dissipate heat and maintain operational temperatures.
- -- System in Package (SiP)
- An integration of multiple ICs, such as processors and sensors, into a single package to enhance functionality while saving space.
Additional Learning Materials
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