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The chapter explores real-world case studies that illustrate various effective thermal management strategies employed in semiconductor applications. It demonstrates how these strategies address challenges in heat dissipation across industries such as consumer electronics, electric vehicles, data centers, and semiconductor manufacturing. Highlighting key techniques like liquid cooling and heat sinks, it emphasizes the importance of maintaining optimal temperatures for performance and reliability.
References
ee6-icp-5.pdfClass Notes
Memorization
What we have learnt
Final Test
Revision Tests
Term: Thermal Interface Materials (TIMs)
Definition: Materials used to improve heat transfer between components such as processors and heat sinks.
Term: Liquid Cooling
Definition: A cooling method that uses liquid coolant to absorb and transport heat from components.
Term: Heat Sinks
Definition: Passive cooling devices that dissipate heat from electronic components.
Term: Thermal Hotspots
Definition: Localized areas within a device that experience higher temperatures due to concentrated heat generation.
Term: Microchannel Cooling
Definition: A technique that enhances heat removal by increasing the surface area for heat transfer using small channels.