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Practice Questions
Test your understanding with targeted questions related to the topic.
Question 1
Easy
What are the three main types of IC packaging?
💡 Hint: Think of the acronym THS.
Question 2
Easy
What is one advantage of Through-Hole Technology?
💡 Hint: Consider its construction involving leads.
Practice 4 more questions and get performance evaluation
Interactive Quizzes
Engage in quick quizzes to reinforce what you've learned and check your comprehension.
Question 1
What is an advantage of Through-Hole packaging?
- Smaller size
- Higher mechanical strength
- Lower costs
💡 Hint: Think about which packaging type is more robust.
Question 2
True or False: Surface-Mount components require drilled holes in the PCB.
- True
- False
💡 Hint: Consider the characteristics of SMT compared to Through-Hole.
Solve 2 more questions and get performance evaluation
Challenge Problems
Push your limits with challenges.
Question 1
Given recent advancements in power electronics, how would you assess the future relevance of Through-Hole packaging in comparison to SMT and BGA?
💡 Hint: Think about trends in miniaturization and power needs.
Question 2
Imagine a new consumer electronic device. Justify your choice of packaging technology considering mechanical stress, component density, and thermal performance.
💡 Hint: Evaluate the trade-offs between performance and handling.
Challenge and get performance evaluation