Practice Substrates - 3.2.1 | 3. Packaging Materials and Interconnection Techniques | IC Packaging
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is a substrate in semiconductor packaging?

πŸ’‘ Hint: Think about what supports the IC.

Question 2

Easy

Name one type of organic substrate.

πŸ’‘ Hint: What is a widely used material for PCBs?

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

Which type of substrate is typically used for high-power applications due to its thermal properties?

  • Ceramic
  • Organic
  • Metal

πŸ’‘ Hint: What material do we rely on for heat management in power devices?

Question 2

True or False: Organic substrates are typically more expensive than ceramic substrates.

  • True
  • False

πŸ’‘ Hint: Think about cost efficiency.

Solve 1 more question and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Evaluate a scenario where an IC operating at high temperatures is being designed for consumer electronics. Which substrate would you recommend and why?

πŸ’‘ Hint: Think about the balance between cost and temperature management.

Question 2

Design a comparative analysis on thermal resistance between ceramic, organic, and metal substrates. What factors must be considered in your analysis?

πŸ’‘ Hint: What properties make ceramic advantageous in thermal management?

Challenge and get performance evaluation