Practice Substrate Preparation (4.2.1) - Apply Microfabrication Techniques to Fabricate Electronic Devices
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Substrate Preparation

Practice - Substrate Preparation

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Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What does SC-1 focus on removing?

💡 Hint: Think about what types of impurities 'organics' could refer to.

Question 2 Easy

What is the purpose of the HF dip in wafer preparation?

💡 Hint: Ask yourself why we need a clean surface for further processes.

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

What is the primary function of SC-1 in the wafer cleaning process?

To remove native oxides
To eliminate organic materials
To enhance metal ion concentration

💡 Hint: Think about the definition of 'organics'.

Question 2

True or False: The HF dip is used to remove metallic contaminants from a silicon wafer.

True
False

💡 Hint: Remember what SC-2 is designed to do.

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Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

Investigate a scenario where improper wafer cleaning was conducted prior to thin film deposition. Describe the potential failures that could occur in the electrical performance of the device.

💡 Hint: Consider what impurities can do to semiconductor layers.

Challenge 2 Hard

Compare the RCA cleaning protocol's effectiveness in a cleanroom versus a standard ambient environment. What differences in wafer quality and reproducibility would you expect?

💡 Hint: Reflect on environmental factors that could affect cleaning outcomes.

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