4. Apply Microfabrication Techniques to Fabricate Electronic Devices
Microfabrication techniques transform semiconductor materials into electronic components such as transistors and diodes, requiring a cleanroom environment and precise process control. The fabrication process involves substrate preparation, thin film deposition, lithography, etching, doping, and metallization, culminating in the creation of devices like MOSFETs. Advanced methods, such as FinFET fabrication and 3D NAND technology, address challenges associated with smaller feature sizes and complexity in integration.
Sections
Navigate through the learning materials and practice exercises.
What we have learnt
- Device fabrication requires sequential deposition, patterning, and etching steps.
- Key metrics include feature size, doping uniformity, and interfacial quality.
- Process integration becomes exponentially complex at smaller nodes (<28 nm).
Key Concepts
- -- Microfabrication
- A process used to fabricate extremely small structures, typically sub-micron or nanometer scale, for electronic components.
- -- Lithography
- A method used in microfabrication to project patterns onto a substrate, critical for defining features in devices.
- -- Doping
- The introduction of impurities into a semiconductor to change its electrical properties, typically through techniques like ion implantation.
- -- Metallization
- The process of depositing metal contacts on a semiconductor device, crucial for electrical connectivity.
Additional Learning Materials
Supplementary resources to enhance your learning experience.