Microfabrication and Semiconductor materials | 2. Design and Implement Microfabrication Processes by Pavan | Learn Smarter
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2. Design and Implement Microfabrication Processes

Microfabrication processes involve a detailed sequence of steps to convert raw semiconductor wafers into functional devices, emphasizing substrate preparation, film deposition, patterning, etching, doping, and packaging. Key techniques such as thin film deposition and advanced lithography are critical as the industry advances towards smaller feature sizes. Yield optimization and integration of emerging techniques are essential for meeting modern fabrication requirements.

Sections

  • 2

    Design And Implement Microfabrication Processes

    This section covers the essential elements of microfabrication, emphasizing process flow, design methodologies, and key techniques.

  • 2.1

    Overview Of Process Flow

    This section defines the structured sequence required to transform raw semiconductor wafers into functional devices through various fabrication stages.

  • 2.2

    Process Design Methodology

    This section covers the essential rules and methodologies for designing semiconductor fabrication processes, emphasizing critical design rules and process simulation techniques used for effective implementation.

  • 2.2.1

    Design Rules

    The design rules section outlines essential parameters that dictate the microfabrication process, including minimum feature size and alignment tolerance.

  • 2.2.2

    Process Simulation

    This section covers the use of process simulation tools like TCAD for virtual prototyping in microfabrication.

  • 2.3

    Key Fabrication Techniques

    This section covers essential fabrication techniques in microfabrication, including thin film deposition, advanced lithography, and etching processes.

  • 2.3.1

    Thin Film Deposition

    This section covers the critical techniques of thin film deposition, including PVD (sputtering) and various CVD methods, highlighting their significance in semiconductor fabrication.

  • 2.3.2

    Advanced Lithography

    Advanced lithography includes key techniques like immersion lithography and EUV lithography, essential for producing small-scale microchips.

  • 2.3.3

    Etching Processes

    The etching processes are critical for defining microstructures on semiconductor wafers, particularly through methods like Deep RIE.

  • 2.4

    Doping Techniques

    This section covers the key doping techniques used in semiconductor fabrication, focusing on ion implantation and diffusion processes.

  • 2.5

    Process Integration Examples

    This section provides practical examples of process integration in microfabrication, focusing on CMOS and MEMS techniques.

  • 2.5.1

    Cmos Fabrication

    This section outlines the key steps in CMOS fabrication, emphasizing critical processes such as well formation, gate deposition, and metallization.

  • 2.5.2

    Mems Process Flow

    This section outlines the MEMS process flow, focusing on surface micromachining and the importance of sacrificial layer etching.

  • 2.6

    Yield Optimization

    Yield optimization in microfabrication focuses on minimizing defect density to maximize the yield of semiconductor devices.

  • 2.7

    Emerging Techniques

    This section discusses emerging microfabrication techniques, highlighting 3D IC stacking and directed self-assembly.

  • 2.8

    Implementation Case Study

    The implementation case study illustrates the specific steps involved in designing a 180nm MOSFET process.

  • 2.9

    Summary

    Microfabrication requires a precise sequence of steps involving deposition, patterning, and etching, with a focus on yield management.

References

ee4-msms-2.pdf

Class Notes

Memorization

What we have learnt

  • Microfabrication consists o...
  • Advanced fabrication techni...
  • Yield management and statis...

Final Test

Revision Tests