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Practice Questions
Test your understanding with targeted questions related to the topic.
Question 1
Easy
What does 3D IC stand for?
💡 Hint: Think about the structure and integration of circuits.
Question 2
Easy
What is the core material typically used in TSVs?
💡 Hint: It conducts electricity efficiently.
Practice 4 more questions and get performance evaluation
Interactive Quizzes
Engage in quick quizzes to reinforce what you've learned and check your comprehension.
Question 1
What technology is primarily used for vertical integration?
- 2D IC Stacking
- 3D IC Stacking
- Layered ICs
💡 Hint: Remember, vertical means 'stacked up.'
Question 2
Directed Self-Assembly primarily uses:
- Mono-polymers
- Block Copolymers
- Single Polymers
💡 Hint: Think about how polymers can have different sections.
Solve 1 more question and get performance evaluation
Challenge Problems
Push your limits with challenges.
Question 1
Imagine you need to design a semiconductor using both TSVs and DSA techniques. Describe how you would integrate these technologies to optimize performance.
💡 Hint: Think about the strengths of both technologies and how they can complement each other.
Question 2
Consider the environmental impact of semiconductor manufacturing. Discuss the energy efficiency changes when employing 3D stacking versus traditional methods.
💡 Hint: Reflect on how energy implications differ with construction styles.
Challenge and get performance evaluation