Practice Introduction to IC Packaging Types - 7.1 | 7. Packaging Types and Trade-offs | IC Packaging
K12 Students

Academics

AI-Powered learning for Grades 8–12, aligned with major Indian and international curricula.

Academics
Professionals

Professional Courses

Industry-relevant training in Business, Technology, and Design to help professionals and graduates upskill for real-world careers.

Professional Courses
Games

Interactive Games

Fun, engaging games to boost memory, math fluency, typing speed, and English skillsβ€”perfect for learners of all ages.

games

Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is through-hole packaging?

πŸ’‘ Hint: Think about how the component is placed on the board.

Question 2

Easy

Name one advantage of surface-mount technology.

πŸ’‘ Hint: Consider size and assembly speed.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

Which of the following is an advantage of through-hole packaging?

  • Higher density
  • Easier to repair
  • Lower manufacturing cost

πŸ’‘ Hint: Consider repairability aspects.

Question 2

True or False: Surface-mount technology eliminates the need for holes in a PCB.

  • True
  • False

πŸ’‘ Hint: Think about the mounting style.

Solve 1 more question and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

In a hypothetical scenario, an engineer needs to design a rugged device for a military application. Outline why through-hole packaging would be a suitable choice, addressing its trade-offs.

πŸ’‘ Hint: Consider durability versus density.

Question 2

Imagine you are tasked with selecting packaging for a next-gen smartphone. Discuss your choice and justify the use of surface-mount or Ball Grid Array packaging, assessing trade-offs.

πŸ’‘ Hint: Think about size and performance needs.

Challenge and get performance evaluation