Practice Introduction To Ic Packaging Types (7.1) - Packaging Types and Trade-offs
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Introduction to IC Packaging Types

Practice - Introduction to IC Packaging Types

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Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What is through-hole packaging?

💡 Hint: Think about how the component is placed on the board.

Question 2 Easy

Name one advantage of surface-mount technology.

💡 Hint: Consider size and assembly speed.

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

Which of the following is an advantage of through-hole packaging?

Higher density
Easier to repair
Lower manufacturing cost

💡 Hint: Consider repairability aspects.

Question 2

True or False: Surface-mount technology eliminates the need for holes in a PCB.

True
False

💡 Hint: Think about the mounting style.

1 more question available

Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

In a hypothetical scenario, an engineer needs to design a rugged device for a military application. Outline why through-hole packaging would be a suitable choice, addressing its trade-offs.

💡 Hint: Consider durability versus density.

Challenge 2 Hard

Imagine you are tasked with selecting packaging for a next-gen smartphone. Discuss your choice and justify the use of surface-mount or Ball Grid Array packaging, assessing trade-offs.

💡 Hint: Think about size and performance needs.

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Reference links

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