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Practice Questions
Test your understanding with targeted questions related to the topic.
Question 1
Easy
What is the main advantage of through-hole packaging?
💡 Hint: Think about where this type would be used.
Question 2
Easy
Which component is typically larger, through-hole or surface-mount?
💡 Hint: Consider their design features.
Practice 4 more questions and get performance evaluation
Interactive Quizzes
Engage in quick quizzes to reinforce what you've learned and check your comprehension.
Question 1
What is one major disadvantage of through-hole packaging?
- Compact size
- Mechanical strength
- Higher assembly cost
💡 Hint: Think about the total time and effort required to assemble these types.
Question 2
True or False: BGA packages can be visually inspected after soldering.
- True
- False
💡 Hint: Consider how soldering processes can affect visibility.
Solve 2 more questions and get performance evaluation
Challenge Problems
Push your limits with challenges.
Question 1
Design a small consumer electronic device, considering power and size constraints. Choose an appropriate packaging type and justify your decision.
💡 Hint: Evaluate space limitations against functional requirements.
Question 2
Evaluate the impact of choosing BGA packaging on manufacturing costs compared to through-hole and SMT. Discuss potential increased challenges.
💡 Hint: Consider the trade-offs in assembly complexity and performance.
Challenge and get performance evaluation