5.6.1. Techniques

Try these first

1. 1.

   What is bulk micromachining primarily used for?

   Hint

   Think about the fabrication processes in MEMS.

2. 2.

   Name a material commonly used in surface micromachining.

   Hint

   Consider the layers used in this technique.

3. 3.

   What is the main purpose of bulk micromachining?

   • To build layers on the wafer
   • To selectively remove material from the wafer
   • To bond silicon to glass

   Hint

   Reflect on the definition of bulk micromachining.

4. 4.

   True or False: Surface micromachining involves removing material from within the substrate.

   • True
   • False

   Hint

   Think about where the structures are formed.

5. 5.

   Discuss how the choice of etching technique impacts the overall design and functionality of a MEMS sensor.

   Hint

   Consider how different etching methods yield varying results.

6. 6.

   Evaluate the role of wafer bonding in enabling modern MEMS devices and discuss potential challenges it may present.

   Hint

   Think about the importance of adhesion in complex device designs.