5. Fabrication Techniques - MEMS
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5. Fabrication Techniques

5. Fabrication Techniques

MEMS fabrication encompasses various micro-scale processes to build mechanical and electrical components, emphasizing bulk and surface micromachining among other advanced methods. Techniques such as etching, wafer bonding, soft lithography, and additive manufacturing each play crucial roles in developing complex and functional microsystems. The chapter provides a comparative overview, highlighting applications and limitations of each technique in the context of MEMS technology.

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  1. 5
    Fabrication Techniques – Bulk Micromachining, Surface Micromachining, And More

    This section covers the major MEMS fabrication techniques, including bulk...

  2. 5.1
    Introduction

    This section introduces MEMS fabrication techniques, emphasizing the...

  3. 5.2
    Bulk Micromachining

    Bulk micromachining uses selective material removal from silicon wafers to...

  4. 5.2.1
    Process Features

    This section covers the features of bulk micromachining, focusing on the...

  5. 5.2.2
    Etching Techniques

    Etching techniques are crucial for MEMS fabrication, allowing the selective...

  6. 5.2.3
    Applications

    The section on Applications explores various practical uses of MEMS...

  7. 5.3
    Surface Micromachining

    Surface micromachining builds microstructures layer by layer on a...

  8. 5.3.1
    Process Features

    This section discusses the distinctive features of surface micromachining in...

  9. 5.3.2
    Typical Materials

    This section examines the typical materials used in MEMS fabrication,...

  10. 5.3.3

    This section discusses the key advantages of utilizing surface...

  11. 5.3.4
    Applications

    This section focuses on the diverse applications of various MEMS fabrication...

  12. 5.4
    High-Aspect-Ratio Micromachining (Harms)

    This section covers High-Aspect-Ratio Micromachining (HARMS), a technique...

  13. 5.4.1
    Techniques Used

    This section explores various fabrication techniques utilized in MEMS,...

  14. 5.4.2
    Applications

    This section covers the various applications of MEMS fabrication techniques,...

  15. 5.5
    Wafer Bonding

    Wafer bonding is a vital process in MEMS fabrication that allows for the...

  16. 5.5.1
    Bonding Methods

    This section covers various wafer bonding methods essential for MEMS...

  17. 5.5.2
    Applications

    This section discusses the diverse applications of MEMS fabrication...

  18. 5.6
    Soft Lithography And Polymer Mems

    This section covers soft lithography and polymer MEMS, highlighting methods...

  19. 5.6.1

    This section discusses various MEMS fabrication techniques, emphasizing bulk...

  20. 5.6.2

    This section discusses materials used in soft lithography and polymer MEMS...

  21. 5.6.3
    Applications

    This section discusses the various applications of MEMS fabrication...

  22. 5.7
    Additive Micromanufacturing

    Additive micromanufacturing techniques, including 3D microprinting, offer...

  23. 5.7.1

    This section highlights key techniques in MEMS fabrication, particularly...

  24. 5.7.2

    Additive micromanufacturing techniques provide significant advantages in...

  25. 5.8
    Comparative Summary Of Techniques

    This section compares various MEMS fabrication techniques based on...

  26. 5.9

    This section highlights the evolution and importance of MEMS fabrication...

What we have learnt

  • MEMS fabrication techniques are adapted from semiconductor manufacturing to create three-dimensional microstructures.
  • Bulk micromachining involves the selective removal of material from a silicon wafer, while surface micromachining builds structures layer by layer.
  • Advanced techniques like wafer bonding and additive manufacturing enable the creation of flexible, complex devices for a variety of applications.

Key Concepts

-- Bulk Micromachining
A fabrication technique that selectively removes material from a silicon wafer to create structures, often using wet or dry etching.
-- Surface Micromachining
A process that builds microstructures layer by layer on a substrate, using structural and sacrificial layers.
-- HighAspectRatio Micromachining (HARMS)
Techniques used to fabricate tall and narrow microstructures, capable of producing intricate and precise designs.
-- Wafer Bonding
Processes used to join silicon wafers or other materials together to create multi-layered MEMS devices.
-- Soft Lithography
A method for creating microstructures using flexible materials, often involving techniques such as replica molding and microcontact printing.
-- Additive Micromanufacturing
Emerging fabrication techniques like 3D microprinting that allow for rapid prototyping and complex geometries.

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