5. Fabrication Techniques
MEMS fabrication encompasses various micro-scale processes to build mechanical and electrical components, emphasizing bulk and surface micromachining among other advanced methods. Techniques such as etching, wafer bonding, soft lithography, and additive manufacturing each play crucial roles in developing complex and functional microsystems. The chapter provides a comparative overview, highlighting applications and limitations of each technique in the context of MEMS technology.
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What we have learnt
- MEMS fabrication techniques are adapted from semiconductor manufacturing to create three-dimensional microstructures.
- Bulk micromachining involves the selective removal of material from a silicon wafer, while surface micromachining builds structures layer by layer.
- Advanced techniques like wafer bonding and additive manufacturing enable the creation of flexible, complex devices for a variety of applications.
Key Concepts
- -- Bulk Micromachining
- A fabrication technique that selectively removes material from a silicon wafer to create structures, often using wet or dry etching.
- -- Surface Micromachining
- A process that builds microstructures layer by layer on a substrate, using structural and sacrificial layers.
- -- HighAspectRatio Micromachining (HARMS)
- Techniques used to fabricate tall and narrow microstructures, capable of producing intricate and precise designs.
- -- Wafer Bonding
- Processes used to join silicon wafers or other materials together to create multi-layered MEMS devices.
- -- Soft Lithography
- A method for creating microstructures using flexible materials, often involving techniques such as replica molding and microcontact printing.
- -- Additive Micromanufacturing
- Emerging fabrication techniques like 3D microprinting that allow for rapid prototyping and complex geometries.
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