Practice X-Ray and Acoustic Microscopy - 8.3.4 | 8. Reliability in IC Packaging | IC Packaging
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Practice Questions

Test your understanding with targeted questions related to the topic.

Question 1

Easy

What is one benefit of using X-ray imaging?

πŸ’‘ Hint: Think about what 'non-destructive' means.

Question 2

Easy

Name one defect that can be detected using acoustic microscopy.

πŸ’‘ Hint: Consider what might be 'hidden' inside.

Practice 4 more questions and get performance evaluation

Interactive Quizzes

Engage in quick quizzes to reinforce what you've learned and check your comprehension.

Question 1

What is the primary use of X-ray imaging in IC packages?

  • Detect solder flaws
  • Increase heat conduction
  • Reduce weight

πŸ’‘ Hint: Think about what inspections aim to reveal.

Question 2

True or False: Acoustic microscopy can detect moisture within IC packages.

  • True
  • False

πŸ’‘ Hint: Consider the specific capabilities of the technique.

Solve and get performance evaluation

Challenge Problems

Push your limits with challenges.

Question 1

Given an IC assembly that has failed in the field, outline how you would use X-ray and acoustic microscopy to analyze the failure. What steps would you take?

πŸ’‘ Hint: Think through the inspection process step-by-step.

Question 2

Imagine a new type of IC package made with a unique material. How would the testing strategies using X-ray and acoustic microscopy change to accommodate this material's properties?

πŸ’‘ Hint: Consider how properties influence the effectiveness of detection methods.

Challenge and get performance evaluation