Practice X-ray And Acoustic Microscopy (8.3.4) - Reliability in IC Packaging
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X-Ray and Acoustic Microscopy

Practice - X-Ray and Acoustic Microscopy

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Practice Questions

Test your understanding with targeted questions

Question 1 Easy

What is one benefit of using X-ray imaging?

💡 Hint: Think about what 'non-destructive' means.

Question 2 Easy

Name one defect that can be detected using acoustic microscopy.

💡 Hint: Consider what might be 'hidden' inside.

4 more questions available

Interactive Quizzes

Quick quizzes to reinforce your learning

Question 1

What is the primary use of X-ray imaging in IC packages?

Detect solder flaws
Increase heat conduction
Reduce weight

💡 Hint: Think about what inspections aim to reveal.

Question 2

True or False: Acoustic microscopy can detect moisture within IC packages.

True
False

💡 Hint: Consider the specific capabilities of the technique.

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Challenge Problems

Push your limits with advanced challenges

Challenge 1 Hard

Given an IC assembly that has failed in the field, outline how you would use X-ray and acoustic microscopy to analyze the failure. What steps would you take?

💡 Hint: Think through the inspection process step-by-step.

Challenge 2 Hard

Imagine a new type of IC package made with a unique material. How would the testing strategies using X-ray and acoustic microscopy change to accommodate this material's properties?

💡 Hint: Consider how properties influence the effectiveness of detection methods.

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