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FinFET technology represents a significant advancement in transistor architecture, addressing the limitations of conventional planar MOSFETs at technology nodes below 22 nm. The chapter outlines the structural characteristics of FinFETs, compares their performance to planar devices, and emphasizes their advantages in terms of leakage control, scalability, and drive current. It also delves into modeling techniques and simulations essential for understanding FinFET behavior in circuit design.
References
ee4-ed2-6.pdfClass Notes
Memorization
What we have learnt
Final Test
Revision Tests
Term: FinFET
Definition: A 3D multigate transistor architecture designed to overcome the scaling limitations of planar MOSFETs.
Term: DIBL
Definition: Drain-Induced Barrier Lowering; a phenomenon in MOSFETs affecting leakage current, which is minimized in FinFETs.
Term: SPICE Modeling
Definition: A simulation environment used for circuit design, which employs compact models to predict FinFET behavior.
Term: CurrentVoltage (IV) Characteristics
Definition: Relationships between the current flowing through the transistor and the voltage across it, crucial for modeling FinFET behavior.