Finfet Scaling And Future Trends

This section discusses the advancements and limitations of FinFET technology and explores future semiconductor trends beyond FinFETs.

Introduction

FinFET technology extends Moore's Law into sub-22nm nodes, but faces scaling limits and new challenges.

Scaling Trends In Finfet Technology

The section discusses the key scaling trends and goals currently impacting FinFET technology as it is utilized in advanced semiconductor nodes.

Limitations Of Finfet Scaling

FinFETs, while beneficial in smaller semiconductor nodes, face several limitations as they scale down in size.

Beyond Finfet: Future Semiconductor Devices

This section discusses advanced semiconductor devices emerging post-FinFET technology, highlighting their advantages and potential applications.

Gate-All-Around Fets (Gaafets)

GAAFETs represent a promising advancement in transistor technology offering superior electrostatic control, potentially overcoming FinFET limitations.

Nanosheet/nanoribbon Fets

Nanosheet/Nanoribbon FETs represent a significant advancement beyond FinFET technology, featuring wider channels and stackable designs for improved performance and density.

Vertical Fets (V-Fets)

Vertical FETs (V-FETs) are a new class of semiconductor devices that allow current to flow vertically from source to drain, offering promising applications for 3D IC integration.

Tunneling Fets (Tfets)

Tunneling FETs (TFETs) utilize band-to-band tunneling for operation, offering significant advantages for ultra-low power applications.

Carbon Nanotube Fets (Cntfets)

Carbon Nanotube FETs leverage the unique properties of carbon nanotubes to significantly enhance electronic performance in semiconductor devices.

2d Material Fets

2D Material FETs utilize ultra-thin materials for semiconductor channels, offering significant advantages in electrostatic control and performance at nanoscale dimensions.

Design And Technology Co-Optimization (Dtco)

Design and Technology Co-Optimization (DTCO) focuses on integrating technology scaling, design innovations, and enhanced EDA tools to aid in semiconductor scaling.

3d Integration And Packaging Trends

This section discusses the advancements in 3D integration and packaging technologies that enable more efficient semiconductor designs as conventional planar scaling becomes economically challenging.

Summary Of Future Trends

This section outlines the key future trends in semiconductor technology, focusing on innovations beyond FinFETs.

Summary Of Key Concepts

This section discusses the evolution of FinFET technology, its current limitations, and introduces next-generation semiconductor devices that promise to extend the scaling of electronics.