Electronic Devices 2 | 5. FinFET Device Structure and Operation by Pavan | Learn Smarter
K12 Students

Academics

AI-Powered learning for Grades 8–12, aligned with major Indian and international curricula.

Academics
Professionals

Professional Courses

Industry-relevant training in Business, Technology, and Design to help professionals and graduates upskill for real-world careers.

Professional Courses
Games

Interactive Games

Fun, engaging games to boost memory, math fluency, typing speed, and English skills—perfect for learners of all ages.

games
5. FinFET Device Structure and Operation

FinFETs are advanced three-dimensional transistors that enhance performance and reduce leakage compared to traditional planar MOSFETs. The chapter details the structure, fabrication process, advantages, and operational principles of FinFETs. It concludes with a comparison to MOSFETs, emphasizing the complexities of fabrication but also the benefits in electrostatics and drive strength, particularly for advanced scaling in modern nodes.

Sections

  • 5

    Finfet Device Structure And Operation

    This section provides an overview of FinFETs, highlighting their 3D structure, manufacturing process, and operational principles.

  • 5.1

    Introduction

    FinFETs are advanced transistors that overcome the limitations of traditional MOSFETs in advanced technology nodes.

  • 5.2

    Finfet Structure

    This section introduces the structure of FinFETs, emphasizing the advantages of their multi-gate geometry over traditional MOSFETs.

  • 5.2.1

    Component Description

    This section describes the key components of a FinFET, highlighting their structure and functions.

  • 5.2.2

    Types Of Finfets

    This section outlines various types of FinFETs, emphasizing their unique structures and applications.

  • 5.3

    Finfet Fabrication Process (Simplified)

    The FinFET fabrication process involves a series of steps to create advanced 3D transistors, focusing on substrate preparation, patterning, gate formation, and interconnects.

  • 5.3.1

    Substrate Preparation

    Substrate preparation is the initial step in FinFET fabrication, utilizing either Silicon-on-Insulator (SOI) or bulk silicon wafers.

  • 5.3.2

    Fin Patterning And Etching

    This section explores the fin patterning and etching process in FinFET fabrication, highlighting the techniques used to define the fin structures.

  • 5.3.3

    Gate Stack Formation

    Gate stack formation involves the deposition of high-Îș dielectric and metal gate materials onto the FinFET structure to enhance electrostatic control.

  • 5.3.4

    Spacer Formation And Source/drain Implantation

    This section focuses on the processes involved in spacer formation and source/drain implantation in FinFETs, crucial for defining the device's electrical characteristics.

  • 5.3.5

    Silicidation And Contacts

    This section discusses the silicidation process and contact formation in FinFETs, emphasizing their importance in achieving low-resistance electrical connections.

  • 5.3.6

    Interconnects

    The section on interconnects discusses the creation of metal layers for wiring in FinFET fabrication, emphasizing techniques like damascene and dual-damascene processes.

  • 5.4

    Key Dimensions In Finfets

    This section outlines the critical dimensions in FinFETs, including fin width, height, and gate length, which influence their electrostatic control and performance.

  • 5.5

    Operating Principle Of Finfets

    FinFETs function through three distinct operational regions, enabling efficient control and reduced leakage current.

  • 5.6

    Advantages Of Finfet Operation

    FinFETs offer significant advantages in transistor operation compared to traditional MOSFETs, including enhanced control over short-channel effects and reduced leakage.

  • 5.7

    Finfet Vs Mosfet Operation

    This section compares the operational characteristics and performance metrics of FinFETs with those of traditional MOSFETs.

  • 5.8

    Design Considerations In Finfets

    The design considerations for FinFETs involve optimizing fin count, fin pitch, and controlling variability to improve device performance while managing area constraints.

  • 5.9

    Summary Of Key Concepts

    FinFETs are advanced transistors that enhance performance and reduce leakage through a 3D channel and multi-gate structure.

References

ee4-ed2-5.pdf

Class Notes

Memorization

What we have learnt

  • FinFET technology effective...
  • The fabrication process of ...
  • FinFETs operate similarly t...

Final Test

Revision Tests